Study on Micron Porous Copper Prepared by Physical Vacuum Dealloying  被引量:3

Study on Micron Porous Copper Prepared by Physical Vacuum Dealloying

在线阅读下载全文

作  者:Yi-Bin Ren Yu-Xia Sun Ke Yang 

机构地区:[1]Institute of Metal Research, Chinese Academy of Sciences,Shenyang 110016, China [2]Shenyang Aerospace University, Shenyang 110136, China

出  处:《Acta Metallurgica Sinica(English Letters)》2016年第12期1144-1147,共4页金属学报(英文版)

基  金:supported by the National Natural Science Foundation of China (Grant No. 31370976);the National Basic Research Program of China (Grant No. 2012CB619101)

摘  要:Porous copper was prepared successfully by physical vacuum dealloying method using the CuZn alloy pre- cursors (Cu30Zn70, Cu40Zn60 and Cu50Zn50 alloys). The micron porous copper showed a three-dimensional continuous porous structure with 1-5 μm pore size. With the increase of the Zn content in the CuZn alloy, the pore structure of the porous copper was more uniform and ordered. Temperature was the key factor for physical dealloying, and the optimized temperature was 500 ℃ for the CuZn alloy. The pores would fuse and disappear when the temperature was over 500 ℃. Physical vacuum dealloying was an effective preparation method for porous copper, which can be used to prepare other porous metals based on the sublimation and the Kirkendall effect.Porous copper was prepared successfully by physical vacuum dealloying method using the CuZn alloy pre- cursors (Cu30Zn70, Cu40Zn60 and Cu50Zn50 alloys). The micron porous copper showed a three-dimensional continuous porous structure with 1-5 μm pore size. With the increase of the Zn content in the CuZn alloy, the pore structure of the porous copper was more uniform and ordered. Temperature was the key factor for physical dealloying, and the optimized temperature was 500 ℃ for the CuZn alloy. The pores would fuse and disappear when the temperature was over 500 ℃. Physical vacuum dealloying was an effective preparation method for porous copper, which can be used to prepare other porous metals based on the sublimation and the Kirkendall effect.

关 键 词:DEALLOYING SUBLIMATION Kirkendall effect Porous copper Cu-Zn alloy 

分 类 号:TG146.11[一般工业技术—材料科学与工程] TB383.4[金属学及工艺—金属材料]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象