三维叠层模块温度监测及故障分析技术  

3D-Stacked memory module temperature monitoring and fault analysis tchnology

作　　者：李梦琳[1] 郑东飞[1] Li Menglin Zheng Dongfei(Xi＇an Microelectronics Technology Institute,Xi＇an 710054, China)

机构地区：[1]西安微电子技术研究所,陕西西安710054

出　　处：《电子技术应用》2017年第1期57-59,共3页Application of Electronic Technique

摘　　要：针对三维叠层存储器三温测试时的温度监测难题,提出了一种利用ATE测试设备测量引脚寄生二极管正向压降,从而监测存储器内部芯片温度的技术。该技术还可用于存储器并联引脚开路失效的故障分析。通过理论推导,得出存储器多引脚并联结构二极管正向压降与温度之间的线性关系,并通过了试验验证。This paper presents one method which can menitor the temperature of 3D-Stacked memory module during full- tempera- ture test. The method measures the pin forward voltage drop of parasitic diodes of the module use ATE test equipment.It can also be used for fault analysis of open failure of memory parallel pins. In this paper, we can get the linear relationship between the memory multi-pin parallel structure diode forward voltage drop and the temperature by the theoretical derivation ,and have verificat- ed it through experiments.

关 键 词：三维叠层存储器 接触测试 温度监测 故障分析 

分 类 号：TN407[电子电信—微电子学与固体电子学]