时间-电位法跟踪磷化过程及温度对磷化成膜的影响  

Tracking of Phosphating Process and Analyzing of Effect of Temperature on Phosphating Finn Studied by Time-Potential Method

作　　者：马爽[1] 邵帅 陈振耀 冯绍彬 陈海松[1] 

机构地区：[1]郑州大学化工与能源学院,河南郑州450001 [2]郑州博物馆,河南郑州450007

出　　处：《材料保护》2016年第12期8-12,共5页Materials Protection

摘　　要：目前对磷化成膜机理及规律的认识受限于测试手段等因素，影响了工艺开发和理论探讨。在工业铁皮表面磷化成膜，采用电化学方法，通过开路电位．时间曲线，原位跟踪了磷化成膜过程，用x射线衍射仪（XRD）对磷化过程不同阶段的磷化膜成分进行了测试、分析；通过动电位极化曲线、硫酸铜点滴试验和扫描电镜（SEM）等研究了温度对磷化成膜的影响：讨论了磷化成膜的电化学机理。研究表明：开路电位一时间曲线中的反应斜率、成膜时间等是研究磷化成膜过程的重要特征参数；温度对低常温磷化成膜过程和膜层的耐蚀性能有显著影响，推荐铁基体低常温磷化以35～45℃为佳。The phosphating coating was prepared on the surface of ingot sheet.The phosphating coating-forming process was in-situ tracked by the open circuit potential-time curve of electrochemical measurement,and the chemical compositions of phosphating coating during different phosphating processes were tested and analyzed by X- ray diffraction(XRD).Besides,the effects of temperature on the properties of coating were studied by potentiodynamic polarization curves,copper sulfate spot test and scanning electron microscopy(SEM),and then the electrochemical mechanism of phosphating coating- formation was discussed.Results showed that the reaction slope of the open circuit potential-time curve and the coating formation time were important characteristic parameters in the process of phosphating coating- formation.The temperature had significant influences on the phosphating coating-formation process at low ambient temperature,and the optimal temperature for phosphating coating-formation on iron substrate was 35-45℃.

关 键 词：低常温磷化 过程跟踪 温度与特征参数 耐蚀性 机理 工业铁皮 

分 类 号：TG174.4[金属学及工艺—金属表面处理]