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作 者:刘蔺慧 陈友兴[1] 王召巴[1] LIU Linhui CHEN Youxing WANG Zhaoba(National Key Lab for Electronic Measurement Technology, North University of China, Taiyuan 030051, China)
机构地区:[1]中北大学电子测试技术国家重点实验室,山西太原030051
出 处:《测试技术学报》2016年第6期467-470,共4页Journal of Test and Measurement Technology
基 金:国家自然科学基金资助项目(61201412)
摘 要:本文利用有限元分析软件COMSOL建立脱粘检测仿真模型,研究了建模过程中几何建模、网格划分、求解、后处理等问题,得到了与实验相似的仿真模型.通过仿真回波信号、声压图,分析了脱粘检测中超声波的发射,传播和接收过程.通过改变模型参数,分析了脱粘长度、激励源尺寸对回波信号的影响,并建立了回波幅值与脱粘长度的关系模型,为脱粘检测定量评判提供了理论依据和参考模型.To study the assessment Method of ultrasonic debonding quantitative,in this paper,the simulation model is built with finite element analysis software COMSOL.And the problem of geometric modeling,meshing,solving and post processing are studied.The process of emission,propagation and reception of ultrasonic waves was analyzed by simulating echo signal and the sound pressure maps.Meanwhile,by changing parameters of model,the influence of debonding length and the size of the excitation source was anlyzed.Then the relationship model between echo signal amplitude and debonding length was established,which provides a theoretical basis for quantitative evaluation of defect.
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