连接时间对TC4合金压力连接界面空洞演化与剪切强度的影响  

Influence of bonding time on void evolution and shear strength of press bonding interface of TC4 alloy

作　　者：杨舜[1] 李宏[1] 于卫新[1] 李淼泉[1] 

机构地区：[1]西北工业大学材料学院,西安710072

出　　处：《塑性工程学报》2016年第6期179-182,共4页Journal of Plasticity Engineering

基　　金：国家自然科学基金资助项目(51275416);中国博士后科学基金资助项目(2014M562447);凝固技术国家重点实验室博士后基金资助项目(BP201503)

摘　　要：采用试验方法研究了在大连接压力30MPa条件下,连接时间对TC4合金压力连接界面空洞演化与剪切强度的影响。试验结果表明,在大连接压力下,TC4合金发生宏观塑性变形;随着连接时间的延长,TC4合金压力连接时的变形程度逐渐增大,促进了界面空洞闭合,连接界面上的空洞尺寸逐渐减小,连接率逐渐增大。连接时间为30min时,连接率达到96.2%。当连接时间由5min延长至10min时,TC4合金压力连接后接头剪切强度逐渐增大;继续延长连接时间,接头处组织发生粗化,接头的剪切强度缓慢降低。The effect of bonding time on the void evolution and shear strength of press bonding interface was investigated in the press bonding of TCA alloy under a high bonding pressure of 30 MPa by experimental methods. The results indicate that the macroscopic plastic deformation of TCA alloy is observed because of the high bonding pressure. With the prolonging of the bonding time, the deformation degree of TCA alloy increases, which promotes the void closure by decreasing the void size and increases the bonding ratio. As the bonding time is 30 min, the bonding ratio is up to 96.2 %. As the bonding time prolongs from 5 rain to 10 min, the shear strength of bond increases; continuing to prolong the bonding time, the shear strength of the bond slowly decreases because of the microstructure coarsening of the bond.

关 键 词：空洞演化 剪切强度 TC4合金 压力连接 连接率 

分 类 号：TG301[金属学及工艺—金属压力加工]