单晶锗各向异性对加工表面粗糙度的影响  

Effect of Germanium Single-crystal Anisotropy on Roughness of Cutting Surface

作　　者：苗实[1] 史国权[1] 石广丰[1] 蔡洪彬[1] 

机构地区：[1]长春理工大学机电工程学院

出　　处：《机械科学与技术》2017年第1期89-94,共6页Mechanical Science and Technology for Aerospace Engineering

基　　金：国家自然科学基金面上项目(51075042)资助

摘　　要：为了减少锗组件加工时易发生断裂破坏和加工表面质量不均一问题,从单晶锗结构的各向异性特征出发,研究了单晶锗材料解理面和滑移面上的应力变化;给出晶体取向对切屑脆-韧去除方式影响程度的判据;建立了单晶锗任意晶面的解理面和滑移面上应力计算模型;分析了单晶锗车削表面粗糙度以及切削力的各向异性分布规律。并对典型晶面及任意晶面的切屑脆-韧去除方式和晶向之间关系进行了计算。通过切削试验,验证了模型和判据的正确性。In order to reduce the fracture damage and the not uniform quality of the machined surface in cutting of germanium element,according to the anisotropic characteristics of germanium single crystal structure,stress the change of the cleavage plane and slip surface of single crystal germanium were studied. The criterion of the degree of the crystal orientation influencing the brittle-ductile removal mode of chip was given. A stress calculation model for the cleavage plane and slip plane of single-crystal germanium arbitrary crystal plane was established,and anisotropy distribution law of machined surface roughness of single-crystal germanium was analyzed. The relationship between the brittle-ductile removal mode of chip and the crystal orientation of the arbitrary crystal plane and typical crystal plane was calculated. The correctness and effectiveness of the criterion and model were verified via ultra precision cutting experiment.

关 键 词：单晶锗 表面粗糙度 各向异性 应力变化 

分 类 号：TG501.1[金属学及工艺—金属切削加工及机床]