工业4.0模式下电子元器件SMT产品质量提升策略  

Strategy for improving the quality of electronic components SMT under the industrial 4.0 mode

作　　者：胡元君 

机构地区：[1]广东省电子信息高级技工学校,广东广州510450

出　　处：《江苏科技信息》2016年第32期35-36,共2页Jiangsu Science and Technology Information

摘　　要：随着信息技术的不断进步以及人们对电子产品性能要求的提高,电子产品朝着更加集成化和智能化方向发展,这对电子制造技术也提出了更高的要求。在这种背景下,SMT技术得到了快速的发展与推广,已经广泛应用于电子组装中。但是在实际操作过程中,由于SMT生产工序较多,任何一个差错都有可能导致质量问题。文章对SMT组装技术进行了研究,并分析生产流程中容易产生的问题,对于提高SMT技术质量具有重要意义。With the development of information technology and people＇s increased requirements on the performance of electronic products, electronic products are becoming more integrated and intelligent, which has put forward higher requirements for the electronics manufacturing technology, in order to ensure the quality of the electronic products with stable performance. In this context, SMT technology has been rapidly developed and promoted, widely used in electronic assembly. But in the actual operation process, as a result of many production procedures of SMT, any error is likely to lead to quality problems. Therefore, this paper studies the SMT assembly technology and analyzes the problems in the production process, which is a great significance to improve the quality of SMT technology.

关 键 词：表面组装技术 产品质量 电子元器件 

分 类 号：TN605[电子电信—电路与系统]