铜及铜合金化学镀Ni-P合金镀层的诱发方法  

Induced Methods of Electroless Ni-P Alloy Coating on Copper and Copper Alloy

作　　者：王敏[1] 刘锦云[2] WANG Mini LIU Jin-yun(Engineering Technology Center, Southwest University of Science and Engineering, Mianyang 621010, China School of Materials Science and Engineering, Xihua University, Chengdu 610039, China)

机构地区：[1]西南科技大学工程技术中心,四川绵阳621010 [2]西华大学材料科学与工程学院,四川成都610039

出　　处：《电镀与环保》2017年第1期4-6,共3页Electroplating & Pollution Control

摘　　要：铜及铜合金本身没有催化活性,其诱发方法比较复杂。综述了外接电源法、化学活化法、电化学活化法等铜及铜合金化学镀Ni-P合金镀层的诱发方法,并展望了诱发方法的发展方向。Copper and copper alloy have no catalytic activity, the induced methods of them are more complex. The induced methods of electroless Ni-P alloy coating on copper and copper alloy, like external power method, chemical activation method, electrochemical activation method, etc, were summarized, and the development direction of induced methods was also predicted.

关 键 词：化学镀Ni—P 合金镀层 铜及铜合金 诱发方法 

分 类 号：TQ153[化学工程—电化学工业]