分子结构对聚酰亚胺泡沫熔体粘度和形貌的影响  

INFLUENCE OF MOLECULAR STRUCTURE ON MELT VISCOSITY AND FEATURES OF POLYIMIDE FOAM

作　　者：胡爱军[1] 李克迪 李姝姝[1] 杨士勇[1] 王磊磊[1] 

机构地区：[1]中国科学院化学研究所,北京100190 [2]浙江中科恒泰新材料科技有限公司,绍兴312369

出　　处：《玻璃钢／复合材料》2017年第1期36-43,共8页Fiber Reinforced Plastics/Composites

基　　金：863计划项目(2015AA033902)

摘　　要：研究了含2,3,3',4'-联苯四酸二酐(a-BPDA)的聚酰亚胺(PI)泡沫材料体系中,泡沫前驱体树脂的热处理温度、计算分子量、二酐分子结构对聚酰亚胺前驱体树脂熔体粘度和泡沫形貌的影响。研究发现,对于a-BPDA/m-PDA/NA体系,计算分子量为1500、密度为100 kg/m3时,前驱体树脂经过260℃/1 h的热处理得到的泡沫材料泡孔均匀、闭孔率可达89%,压缩强度为1.34 MPa,压缩模量为37.1 MPa;在该体系中,部分引入ODPA或BTDA,可降低材料制备成本,同时拥有PI泡沫原有的形貌和闭孔率。In a 2,3,3＇,4＇-biphenyltetracarboxylic dianhydride（ a-BPDA） polyimide（ PI） foam system,we studied the influence of thermal treatment temperature,calculated molecular weight and dianhydride molecular structure on the melt viscosity of precursor resin and the features of foam. We found that in a-BPDA/m-PDA/NA system,we were able to make uniform foam with outstanding features when precursor resin calculated molecular weight is 1500 g/mole,foam density is 100 kg/m3 and thermal treatment is 260 ℃/1 hr. The foam has 89% closedcell content,1. 34 MPa compression strength and 37. 1 MPa compression modulus. Partially introducing ODPA or BTDA into this PI foam system can reduce the cost,and maintain those good features and closed-cell content of the foam.

关 键 词：聚酰亚胺泡沫 耐高温 熔融粘度 闭孔 

分 类 号：TB332[一般工业技术—材料科学与工程]