低压变频器功率单元温度波动问题研究  

Research on Temperature Swing of Power Module in Low Voltage Converter

作　　者：高成海[1] 万健如[1] 孙彦虎 

机构地区：[1]天津大学电气与自动化工程学院,天津300072 [2]西门子电气传动有限公司,天津300384

出　　处：《电源学报》2017年第1期99-104,共6页Journal of Power Supply

基　　金：国家质检总局公益性行业科研专项经费资助项目(201310153)~~

摘　　要：为了更好地在设计和运行中使强迫风冷式低压变频器和负荷相匹配,针对影响变频器寿命的IGBT芯片的温度波动问题,在变频器功率模块热路模型基础上运用非稳态传热理论研究。结合脉宽调制特点讨论典型功耗热源的产生和计算,以及周期负荷对功率模块其他部件和芯片的不同热效应及计算。基于热膨胀原理研究芯片温度波动与变频器寿命的关系。通过研究得出温度波动与功耗脉冲周期的关系,以及作为温度波动的主要影响区段,在变频器低输出频率区间如何计算以实施降低输出电流、开关频率等应对温度波动的措施。In order to enhance the matching between force cooling frequency converters and load in design and operation,the temperature swing of IGBT chips,which impact the life time of converter, was researched based on its thermal circuit model and unsteady heat transfer theory. The generation and calculation of typical power dissipation of converter power module and its heat effect was analyzed combined with the characteristics of Pulse Width Modulation . Applying thermal expansion principle the relationship between temperature swing of chips and lifetime of converter was described . The relationship between temperature swing and power dissipation cycle is worked out and how to implement the deduction of output current and switching frequency in main concerned low output frequency range.

关 键 词：变频器 功率单元 温度波动 寿命 低输出频率 

分 类 号：TM464[电气工程—电器]