弹载红外热像仪的热设计和热分析  

Thermal Design and Analysis for Missile-borne Infrared Thermograph

作　　者：常虹[1] 刘勇[1] 魏小林[1] 林森[1] 

机构地区：[1]北京航天计量测试技术研究所,北京100076

出　　处：《宇航计测技术》2016年第6期5-8,共4页Journal of Astronautic Metrology and Measurement

摘　　要：受弹上空间限制,弹载红外热像仪电子、光学、探测器和机械器件通常高度集成于狭小空间,热像仪成像质量以及探测器性能受内部器件发热及机械件传导入的外热流影响。为确保热像仪正常工作并拥有较高的成像质量,需对热像仪进行热控设计。本文根据热像仪的热环境和结构特点进行了热控设计,采用被动热控措施延长系统的热时间常数。建立了热传输模型,针对热控设计和热像仪的工况进行了热仿真分析,分析结果表明本文采用的热设计措施可将热像仪的温度控制在10℃~60℃之间,满足红外热像仪正常工作的热控指标要求,为提高红外热像仪的可靠性和热控设计提供了依据。Be restricted within the narrow space,missile-borne infrared thermograph integrates the electrical,optical and mechanical components in limited space. The imaging quality of thermograph and detector capability will be affected by the heat dissipation of internal components and the external heat flux conducted by mechanical parts. Thermal design is needed to guarantee its normal work and high imaging quality in outer space. In this paper thermal design was taken according to the thermal environment and the structure characteristic of the thermograph. Passive control methods were used to extend the thermal time constant. The heat transfer model was built,and the simulation was taken based on the thermal control methods and the work condition. The analysis results showed that the temperature of thermograph was between 10℃ ~ 60℃,which met the thermal control index. Through the analysis,a warrant for reliability of thermograph and optimization of thermal design was provided.

关 键 词：红外热像仪 热设计 热分析 

分 类 号：TN219[电子电信—物理电子学]