用于Ku波段T/R组件的三维微波传输电路设计实现  

Design and Implementation of 3D Microwave Transmission Circuits for Ku-band T/R Module

作　　者：刘建勇[1] 金雁冰[1] 陈兴国[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,合肥230088

出　　处：《电子技术（上海）》2016年第12期71-74,共4页Electronic Technology

摘　　要：文章介绍了一种用于低成本T/R组件的多层微波复合基板,并给出了两种采用该基板形式实现的三维微波传输电路,详细阐述了其设计方法及实现过程,并通过实物制作和测试验证了其性能指标。这两种电路具有屏蔽性好、驻波小、实用性强等优点。目前该电路已在Ku波段低成本T/R组件中得到了良好的应用。In this paper a kind of multilayer microwave compsite substrate for low cost T/R modules is introduced, and two 3D microwave transmission circuits in the form of the substrate are presented also. The design method and realization of the circuits are expouded in detail here, and their performance is successfully approved. The two circuits have the advantages of good shielding performance, low VSWR, strong practicability and so on, and have been well applied to Ku-band T/R modules at low cost.

关 键 词：KU波段 三维微波传输电路 T/R组件 多层微波复合基板 低成本 

分 类 号：TN958.92[电子电信—信号与信息处理]