功率器件封装失效分析及其研究进展  

Packaging failure analysis and its research progress of the power device

作　　者：洪彬[1] 胡菊 吕顺雅 刘清 侯静 王红美 

机构地区：[1]天津大学内燃机研究所,天津300072 [2]天津市天波科达科技有限公司,天津300384

出　　处：《热固性树脂》2017年第1期66-70,共5页Thermosetting Resin

摘　　要：针对目前塑封功率器件中封装失效研究的现状,概述了封装失效问题愈发严重的原因及其危害,分别从试验研究和建模仿真研究2个方面指出环境因素对环氧树脂等有机封装材料的特性和封装器件的可靠性影响显著,阐述了塑封功率器件中封装失效与环境因素之间的作用关系,并分析了封装失效过程及失效机理。基于上述分析,总结各种研究方法存在的优势与弊端以及目前研究工作中存在的疏漏。最后,对封装失效的后续深入研究工作提出了展望与期许。Aimed at the latest research status of packaging failure in the plastic-encapsulated power device, the reason and the damage of packaging failure were summarized. It was pointed out from two aspects experimental research and modeling simulation research, respectively that the environmental factors had significant influence on the properties of organic packaging materials such as epoxy resin and the reliability of encapsulated devices. The relationship between packaging failure and environmental factors in plastic-encapsulated power device was expounded. The packaging failure process and failure mechanism were analyzed. Based on the above analysis, the advantages and disadvantages of various research methods and the omissions in the current research work were summarized. At last, the prospect and expectation of the further research on encapsulation failure were put forward.

关 键 词：环氧树脂 塑封功率器件 封装失效 试验研究 建模仿真 环境因素 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业] TQ213.5