Li_2O-Al_2O_3-SiO_2系统低膨胀微晶玻璃性能研究  被引量:1

Preparation and Characterization of Low Expansion Glass Ceramics with Li_2O-Al_2O_3-SiO_2 System

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作  者:郑涛[1] 狄健[2] 李正宇[1] 王丹[1] 丁宁[1] 吕景文[1] ZHENG Tao DI Jian LI Zhengyu WANG Dan DING Ning LV Jingwen(School of Materials Science and Engineering, Chmlgchun University of Science and Technology, Changchun 130022 Jishi Media Company Limited, Changchun Branch, Changchun 130000)

机构地区:[1]长春理工大学材料科学与工程学院,长春130022 [2]吉视传媒股份有限公司长春分公司,长春130000

出  处:《长春理工大学学报(自然科学版)》2016年第6期67-70,共4页Journal of Changchun University of Science and Technology(Natural Science Edition)

基  金:国家重点研发计划项目(2016YFB0303805)

摘  要:Li_2O-Al_2O_3-SiO_2系统微晶玻璃是一种具有耐高温、耐热冲击、热膨胀系数低等性能的新型玻璃材料,受到科研人员的广泛关注。通过改变Li2O-Al_2O_3-SiO_2系统微晶玻璃的基础配方以及热处理制度,制备了具有较低热膨胀系数的Li_2O-Al_2O_3-SiO_2系统微晶玻璃。结合运用差热热重、X射线衍射、扫描电镜等测试分析方法,研究性能与其组分、微观结构和热处理制度之间的相互联系。结果表明:通过对热处理制度的调整,促进了玻璃的析晶过程,核化温度和晶化温度有所降低。玻璃析出的主晶相为Li_XAl_XSi_(1-X)O2,最低热膨胀系数达到25.365×10^(-7)℃^(-1)。Lithium aluminum silicate(LAS) system is a kind of new materials with low expansion,high temperature resistance,heat shock and other special properties,and more and more attention of researchers at home and abroad. In this paper,by changing the basic composition and heat treatment system of LAS system glass-ceramics,the relationship between the composition, heat treatment system, microstructure and special properties were studied, combining with the DAT,XRD,SEM and other microstructure test analysis method. Through the experiment,reasonable composition and heat treatment were determined,and the glass ceramics with low thermal expansion coefficient were prepared.The results showed that:through the development of reasonable heat treatment process,the melting temperature and crystallization temperature of the base glass are obviously decreased,and the crystallization process of the glass ceramics was promoted. In the experiment, transparent glass ceramics with Li_XAl_XSi_(1-X)O_2 as the main crystal phase were obtained,and the lowest thermal expansion coefficient was 25.365×10-7℃-1.

关 键 词:锂铝硅系统 晶化温度 热处理制度 

分 类 号:TQ171[化学工程—玻璃工业]

 

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