不同的热风整平无铅焊锡对焊接性能的影响  

Study on the infl uence of solderability with different lead free HASL solder

作　　者：付凤奇 陆玉婷 邝美娟 侯丽娟 FU Feng-qi LU Yu-ting KUANG Mei-juan HOU Li-juan

机构地区：[1]深圳市景旺电子股份有限公司,广东深圳518102

出　　处：《印制电路信息》2017年第2期31-35,共5页Printed Circuit Information

摘　　要：文章通过锡扩散性试验、锡指示试验、润湿天平试验及推力试验,研究了锡银铜、锡铜钛、锡铜镍等三种不同无铅热风整平焊锡对焊接性能的影响。结果表明,润湿性最好的是锡铜钛,其次为锡铜镍,锡银铜的润湿性最差;焊接强度最好的是锡铜钛,其次依次为锡银铜、锡铜镍。This paper is focused on the influence on solderability for 3 types of LF HASL （SnCuAg/ SnCuTi/SnCuNi） based on solder spread test, solder indicator test, wetting balance test as well as thrust test. The result shows that SnCuTi boasts of the best wetting, and then it＇s SnCuNi, while SnCuAg is the worst; For soldering strength. SnCuTi is the best, following SnCuAg and SnCuNi accordingly.

关 键 词：锡银铜 锡铜钛 锡铜镍 润湿性 焊接强度 

分 类 号：TN41[电子电信—微电子学与固体电子学]