多芯片真空共晶工装设计方法研究  

Fixture Design of Multichip Vacuum Eutectic Soldering

作　　者：王辉[1] 庞婷[1] 

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2017年第1期12-13,52,共3页Electronics Process Technology

摘　　要：共晶焊接是微电子组装中的一种重要的焊接工艺。相比手动摩擦共晶,真空共晶具有无需摩擦、不易损伤芯片和可同时共晶多芯片等优势。介绍了多芯片真空共晶焊接工装夹具的设计方法,可实现芯片焊接定位精度优于±50μm。Eutectic soldering is an important technology of micro-electronic assembly. Compare with the manual friction eutectic soldering with tweeze, the vacuum eutectic soldering does not need friction, is not easy to damage the chip, and can solder several dies at same time. Introduce the design method of vacuum eutectic soldering fixture. It is approved that the assembly precision of chip is better than ±50 μm.

关 键 词：共晶焊接 真空 工装夹具 

分 类 号：TN605[电子电信—电路与系统]