SiC颗粒-SiC晶须混杂填料/双马来酰亚胺树脂导热复合材料的制备与性能  

Preparation and properties of SiC_P-SiC_W hybrid fillers/bismaleimide thermal conductivity composites

作　　者：党婧 刘婷婷[2] 

机构地区：[1]中航工业第一飞机设计研究院标准工艺材料研究所,陕西阎良710089 [2]第二炮兵指挥学院,武汉430012

出　　处：《复合材料学报》2017年第2期263-269,共7页Acta Materiae Compositae Sinica

基　　金：国家自然科学基金(51403175)

摘　　要：以双马来酰亚胺树脂(BMI)为树脂基体,二烯丙基双酚A(DABA)为增韧剂,γ-缩水甘油醚氧丙基三甲氧基硅烷(KH-560)表面改性的SiC颗粒-SiC晶须(SiCP-SiCW)为复配导热填料,浇注成型制备SiC_P-SiC_W/BMI导热复合材料,分析研究SiC形状、用量、质量比及表面改性对SiC_P-SiC_W/BMI导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明,当改性SiC_P-SiC_W用量为40wt%且SiC_P∶SiC_W质量比为1∶3时,SiC_P-SiC_W/BMI导热复合材料具有最佳的综合性能,导热系数λ为1.125W(m·K)^(-1),介电常数ε为4.12,5%热失重温度为427℃。Functionalized SiC particle-SiC whisker（SiCP-SiCW）hybrid fillers byγ-glycidoxypropyltrimethoxysilane（KH-560）were performed to fabricate the functionalized SiCP-SiCW/bismaleimide（SiCP-SiCW/BMI）thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A（DABA）as a toughening agent,respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric mechanical properties and thermal stabilities of the functionalized SiCP-SiCW/BMI thermal conductivity composites were investigated.The results show that the functionalized SiCP-SiCW/BMI thermal conductivity composite with 40wt% functionalized SiCP-SiCW（1∶3,mass ratio）hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficientλof 1.125 W（m·K）-1,dielectric constantεof 4.12,and 5wt%thermal mass loss temperature of 427 ℃.

关 键 词：双马来酰亚胺树脂 二烯丙基双酚A SIC颗粒 SIC晶须 导热复合材料 

分 类 号：TQ327.8[化学工程—合成树脂塑料工业]