单晶硅水导/水辅助激光切割加工对比研究  

Contrastive Study of Water Jet Guided Laser and Water Jet Assisted Laser Cutting of Monocrystalline Silicon

作　　者：孙冬[1] 王军华[1] 韩福柱[1] 

机构地区：[1]清华大学机械工程系,北京100084

出　　处：《应用激光》2016年第6期723-727,共5页Applied Laser

基　　金：国家自然科学基金资助项目(项目编号:51575308);高等学校博士学科点专项科研基金资助项目(项目编号:20131019064)

摘　　要：水导激光加工技术与水辅助激光加工技术是目前广泛应用与研究的两种激光水射流复合加工技术,都可以代替传统机械加工方法对单晶硅片进行划片切割工作。但由于激光与水射流耦合方式不同,单晶硅片切割加工效果存在显著差异。在确保激光参数与水射流参数相同的前提下,分别采用上述两种加工方法对单晶硅片进行划槽加工,对比研究其槽道深度与宽度、槽道截面形状、熔渣残留及热影响区等方面的差异性,并综合分析导致差异的根本原因。实验结果表明,相比水辅助激光加工,水导激光加工的槽道宽而浅,呈"V"字形,但其槽道表面干净熔渣少,无毛刺,热影响区较小,更适用于晶圆的高精划片切割加工。In all kinds of hybrid laser-water jet technologies, water jet guided laser technology and water jet assisted laser tech- nology are currently widely used and studied. They can be used to scribe monocrystalline silicon wafer in place of traditional machining methods. But there are some significant differences in monocrystalline silicon cutting processing effect between two methods because of the different coupled mode of laser and water jet. On the premise of same laser parameters and water jet pa- rameters, we carried out the cutting experiments on monocrystalline silicon using the two methods above. Based on the pro- cessed sample, we contrastive studied the differences of the groove depth and width, groove cross section shape, the residual and the heat affected zone（HAZ）, also comprehensive analysis of the basic reasons for differences. The experiments show that compared with groove processed by water jet assisted laser, the groove processed by water jet guided laser is wider and shallo- wer, with a V-shaped appearance. But the groove processed by water jet guided laser is cleaner than that processed by water jet assisted laser with less slag, no burr and small heat affected zone. Therefore, water jet guided laser technology is more suitable for high precision scribing of silicon wafer.

关 键 词：水导激光 水辅助激光 单晶硅 对比研究 

分 类 号：TG665[金属学及工艺—金属切削加工及机床]