复合材料粘接结构红外锁相热像法检测  

Lock-in Infrared Thermography in Composite Bonding Structure

作　　者：林鑫[1] 刘哲军[1] 葛丽[1] 程茶园[1] 伍颂[1] 

机构地区：[1]航天材料及工艺研究所,北京100076

出　　处：《无损检测》2017年第1期49-51,55,共4页Nondestructive Testing

摘　　要：复合材料粘接结构在制造和服役过程中会产生多种类型的缺陷,而现有无损检测方法难以快速检测此类结构。介绍了红外锁相热像法的检测理论,并结合复合材料粘接结构特性,对红外锁相热像法检测参数进行了设定。使用红外锁相热像法对产品进行现场检测试验,结果表明,该方法适用于复合材料粘接结构在生产、修补、在役过程中的质量控制。Different kinds of defects are found in curved composite bonding structures both in manufacturing and in serving stages.Nondestructive testing methods available now are not capable of the in-situ testing of curved composite bonding structure with high speed.Lock-in infrared thermography is characterized by non-contact,large-sized testing area,audio-visual results,et al.It is fit for the in-situ testing of curved composite bonding structure. The best testing conditions of Lock-in infrared thermography are obtained by testing of defects in composite bonding structure samples.The in-situ testing is experimented industrially.It is shown that the lock-in infrared thermography could be applied to curved composite bonding structures in manufacturing,repairing and serving stages.

关 键 词：红外锁相热像法 复合材料粘接质量 产品检测 

分 类 号：TN215[电子电信—物理电子学]