SiC_P/ZA27复合材料界面微结构分析及高温蠕变性能  

INTERFACE STRUCTURES AND HIGH TEMPERATURE CREEP PROPERTY OF SiC_P/ZA27 COMPOSITE

作　　者：祝要民[1] 谢敬佩[1] 李晓辉[1] 李炎[1] 

机构地区：[1]洛阳工学院,洛阳471039

出　　处：《复合材料学报》2002年第4期42-45,共4页Acta Materiae Compositae Sinica

摘　　要：利用透射电镜分析和高温持久硬度试验 ,研究了 Si CP/ ZA2 7复合材料界面微结构和高温蠕变性能。结果表明 ,Si CP/ ZA复合材料具有较好的高温蠕变性能。对其试样进行微观分析 ,基体中的 η相和增强相 Si CP都能显著提高 ZA2The interface structure and high temperature creep property of the SiCp/ZA27 composite have been investigated by means of TEM and HREM. The results show that there are an amorphous layer of 20 nm thick and polygonal shaped precipitates on the interface between SiC particles and the ZA27 matrix. It is found that SiC particles and the even precipitate of the fine η phase in the ZA27 matrix can enhance the high temperature creep property of the composite remarkably.

关 键 词：SICP/ZA27复合材料 界面微结构 高温蠕变性能 金属基复合材料 ZA27合金 碳化硅颗粒 

分 类 号：TN333[电子电信—物理电子学]