五层粘接结构的断裂行为模拟研究  

Simulation Investigation on Five Adhesive Layers Fracture Characteristic of Adhesively Bonded Joints

作　　者：张军[1] 李志宏[1] 贾宏[1] ZHANG Jun LI Zhihong JIA Hong(School of Chemical Engineering and Energy, Zhengzhou University, Zhengzhou 450001 ,China)

机构地区：[1]郑州大学化工与能源学院,河南郑州450001

出　　处：《郑州大学学报（工学版）》2017年第1期22-26,共5页Journal of Zhengzhou University（Engineering Science）

基　　金：国家自然科学基金资助项目(10972200);河南省国际合作项目(144300510008)

摘　　要：粘接技术已被广泛应用,断层及开裂失效是粘接结构常见的失效类型.建立了五层粘接结构模型,分别是被粘物体、粘接界面和粘接材料.分别对搭接结构和对接结构的不同断裂形式进行了模拟计算.结果表明,粘接界面内聚力强度小于或大于粘接材料强度,断裂出现在较弱粘接面上;粘接界面内聚力强度等于粘接材料层强度,粘接材料层与粘接界面均出现破坏;搭接结构的断裂方式与对接结构的断裂方式相同.本研究结果可用于工程实际的粘接强度分析.The adhesively bonding technology has been widely used. The delamination and cracking failure is main failure form of adhesive structure. This paper used the VUMAT subroutine and bonding structure models based on the bond behavior of the contact interface to establish the adhesive structure of five layers. The different crack processes of butt joint and lap joint were simulated. The results showed that the adhesive structure failures was consistent with the predicted under the bonding strength of interface less than or greater than the adhesive layer. The fracture occurre on the weak bonding layer. The adhesive layer and the bonding interface occurre failure simultaneously under the bonding strength of interface equal to the adhesive layer. The fracture mechanisms of lap joint are the same with the butt joints. These findings can be useful in practical engineering analysis of the bonding strength.

关 键 词：胶黏剂 粘接界面层 粘接层 断裂 内聚力模型 

分 类 号：TQ340.1[化学工程—化纤工业]