高强高导Cu-Nb微观复合材料热稳定性  

Thermal Stability of High Strength and High Conductivity Cu-Nb Microcomposites

作　　者：梁明[1] 王鹏飞[1] 徐晓燕[1] 焦高峰[1] 李成山[1] 张平祥[1] 

机构地区：[1]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2017年第2期382-386,共5页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51031002)

摘　　要：通过集束拉拔技术制备了高强高导Cu-Nb微观复合材料,采用X射线衍射和扫描电镜等手段分析了不同热处理条件下材料晶体取向和界面结构的演变,通过应力应变曲线和电导测试研究了不同热处理条件对材料强度和电导的影响规律,结果表明:700℃热处理就可促使形成Cu、Nb的再结晶织构,由极塑变形所导致的区域化学势差异及原子扩散是影响Cu/Nb界面稳定性的关键因素;而700℃的中间热处理可以极大改善材料后续的加工塑性,同时在一定后续形变量条件下仍可获得高强度性能,而且通过低温调整热处理可改善材料导电性,同时保持较高强度。High strength and high conductivity Cu-Nb microcomposites were fabricated by an accumulated bundling and drawing process. The crystal orientation and morphology of Cu-Nb materials under different HT conditions were investigated by X-ray diffraction and scanning electron microscopy. The change rules of strength and conductivity at different HT states were investigated by stress-strain and resistivity measurements. Results indicate that recrystallization textures are formed after HT at 700 ℃. Chemical potential difference and atomic diffusion caused by serve plastic deformation are key factors of interface stability. And intermediate HT at 700 ℃ will be of great benefit to improve the mechanical properties of Cu-Nb microcomposites. It is believed that low temperature adjustment could improve the material plasticity and keep the material strength.

关 键 词：CU-NB 高强度 高电导 热稳定性 

分 类 号：TB331[一般工业技术—材料科学与工程] TG156[金属学及工艺—热处理]