微波多层化构建之热固性粘结片压合技术  

The thermosetting adhesive technology of the microwave multilayer printed circuit board

作　　者：杨维生[1] 

机构地区：[1]南京电子技术研究所,江苏南京210013

出　　处：《印制电路信息》2017年第3期43-50,共8页Printed Circuit Information

摘　　要：针对聚四氟乙烯微波介质基板,构建多层印制电路可供选用之热固性粘结片材料、以及多层化制造技术进行了详细介绍,此外,对热固性粘结片材料的性能需求进行了探讨。According to the Teflon microwave dielectric substrate, this paper introduces the thermosetting adhesive materials for multilayer printed circuit board as well as the manufacturing technology of multilayer in detail. In addition, the performance of thermosetting bonding sheet requirements are discussed as well.

关 键 词：微波 多层化 热固性粘结片 

分 类 号：TN41[电子电信—微电子学与固体电子学]