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出 处:《电镀与精饰》2017年第3期9-12,共4页Plating & Finishing
摘 要:铝合金是常用的导电类零部件基材,工程上一般采用电镀铜或热喷涂铜技术在铝合金零部件表面制备单质铜涂层提高其导电性,但电镀铜层与基体结合不稳定,热喷涂铜涂层存在粗糙度大、易氧化的问题。以冷喷涂技术为手段在2A12铝合金基体上制备单质铜涂层,采用显微镜、扫描电镜、X-射线衍射、表面粗糙度测量仪、显微硬度计和划痕试验机进行涂层组织与性能研究。结果表明,涂层氧化率较低,粗糙度与电弧喷铜涂层相比明显减小,涂层组织过渡良好,未发现明显的疏松与空洞,结合力高于电弧喷涂涂层,电阻率约小于电弧喷涂。Aluminium alloys is commonly used as conductive components. Electroplating technology or thermal spray technology are normally employed to prepare pure copper coating on the surface of aluminium alloy parts to enhance its electrical conductivity. However, the bonding strength of coating prepared by electroplating is unstable while the coating prepared by thermal spray technology is prone to oxidation and has large roughness. In this paper, pure copper coating was prepared on 2A12 surface using cold spray technology, the microstructure and properties of the coatings were investigated by microscope, scanning e- lectron microscope, X - ray diffraction, surface roughness measuring instrument, microhardness instrument and scratch tester. The results showed that the oxidation rate of coating was low and the roughness was significantly reduced as comparing with that of the arc sprayed copper coating. The transition of microstructure was good and no loose and cavity is witnessed. The bonding strength of coating was higher than that of the arc sprayed copper coating while the resistivity was lower.
分 类 号:TG174.442[金属学及工艺—金属表面处理]
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