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作 者:江伟[1] 邹静[2] JIANG Wei ZOU Jing(Department of Mining Engineering, Liupanshui Normal College, Liupanshui 553004, China Department of Materials Engineering, Liupanshui Normal College, Liupanshui 553004, China)
机构地区:[1]六盘水师范学院矿业工程系,贵州六盘水553004 [2]六盘水师范学院材料工程系,贵州六盘水553004
出 处:《铸造技术》2017年第3期566-568,共3页Foundry Technology
摘 要:采用固相反应法制备电子工业用BaZr_xTi_(1-x)O_3材料,研究不同烧结温度和时间的物相组成、显微组织形貌和介电性能。结果表明,随着烧结温度的升高,BaZr_xTi_(1-x)O_3中的物相组成没有明显变化,但结构由四方体变为立方体;当烧结温度从1 250℃升高至1 350℃时,材料的平均晶粒尺寸从29μm增加至39μm;当晶粒尺寸较小时,材料主要形成90°畴和180°畴,增加晶粒尺寸,材料主要形成180°畴。BaZrxTi1-xO3 materials for electronic industry were prepared by solid phase reaction method. The phase composition, microstructures and dielectric properties under different sintering temperature and times were studied. The results show that with the increase of sintering temperature, there is no significantly change in the BaZrxTi1-xO3 compositions, but the crystal structure of this materials changes from rectangle shape to the cubic shape; when increasing sintering temperature from 1 250 ℃ to 1 350 ℃, the average grain size increases from 29 p,m to 39 μm; when the grain size of the materials is small, it mainly consists of 90° domain and 180° domain, but when increasing grain size, 180° domain became the dominate structure.
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