累积和与指数加权移动平均控制图在表面贴装技术中的应用及仿真  

Application and Simulation of CuSum and EWMA Control Chart in Surface Mount Technology

作　　者：孙丹妮[1] 周娟[1] 耿豪凯 桑愔愔 周莹菲 

机构地区：[1]中国计量大学质量与安全工程学院,杭州310018

出　　处：《机械制造》2017年第3期77-80,共4页Machinery

基　　金：国家自然科学基金资助项目(编号:71071138);国家质量监督检验检疫总局科技计划项目(编号:2015QK286)

摘　　要：随着电子产品集成度不断提升,表面贴装技术(SMT)对检测小波动的要求越来越高,需要使用控制图加以检测。将累积和控制图与指数加权移动平均控制图应用在SMT生产工艺中,以提高小波动的检测能力。在实际测试中确认,所设计的方法可实现SMT中锡膏印刷的高精度小波动检测,满足工业生产的要求。Along with the continuous upgrading of the integrated level of electronic products, the ever high requirements on detection of small fluctuations in SMT need to use control chart for the detection. The CuSum control charts and the EWMA control charts were used in the SMT production process to improve the ability in detecting small fluctuations. In the actual test it confirms that the design method can realize high-precision detection of small fluctuations during solder paste printing in SMT and can satisfy the requirements of industrial production.

关 键 词：表面贴装技术 累积和 指数加权移动平均 控制图 检测 

分 类 号：TH165.4[机械工程—机械制造及自动化] TP391.7[自动化与计算机技术—计算机应用技术]