低熔点瓷化粉表面处理及其效果表征  

Surface Treatment and Characterization of Low-Melting Point Filler

作　　者：邵海彬[1] 王庭慰[2] 张尔梅[1] 吴鑫[1] SHAO Hai- bin WANG Ting- wei ZHANG Er-mei WU Xin(Jiangsu Province Key Laboratory of Polymer Materials for Special Cable Usage Address,Zhongli Sci-Tech Group Co., Ltd., Changshu 215542, China College of Materials Science and Engineering, Nanjing University of Technology, Nanjing 210009, China)

机构地区：[1]中利科技集团股份有限公司江苏省特种电缆高分子材料重点实验室,江苏常熟215542 [2]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电线电缆》2017年第2期26-28,32,共4页Wire & Cable

基　　金：江苏省"六大人才高峰"项目(XCL-046)

摘　　要：以硅烷、硬脂酸、十六醇等为表面处理剂对低熔点瓷化粉进行了表面处理,采用不同表征方法对表面处理效果进行了表征,并采用绝缘电阻法研究了不同处理剂、处理工艺对瓷化粉表面处理效果的影响。结果表明:绝缘电阻法的表征结果最为接近实际;预处理工艺的表面处理效果优于共混处理工艺;硬脂酸的表面处理效果最好,但不能彻底解决瓷化粉的长期吸潮问题。Low melting point filler was treated using silane, stearic acid, cetyl alcohol etal as surface treating agent. The surface treatment was characterized by different methods, and the effect of surface treatment of agents and treat-ment process were investigated. The results showed that the result of insulation resistance method was most close to practical application, the effect of pretreatment was better than blending process, the surface treatment of stearic acid was best, but the absorption of moist of ceramifiable filler in long time was not completely resolved.

关 键 词：陶瓷化 表面处理 低熔点瓷化粉 

分 类 号：TM215.2[一般工业技术—材料科学与工程]