一种堆叠式小型高速信号处理模块的热分析研究  

Study on thermal analysis of a stackable small high-speed signal processing module

作　　者：涂炯[1] 秦友伦[1] 祝本明[1] 

机构地区：[1]中国兵器工业第五八研究所,四川绵阳621000

出　　处：《电子设计工程》2017年第6期5-8,13,共5页Electronic Design Engineering

基　　金：国家自然科学基金项目(61133016)

摘　　要：针对小型高速信号处理模块逐渐向小型化、微型化、便携式发展的特点,提出了一种堆叠式小型高速信号处理模块预设计方案。该方案依据设备全密闭腔体结构,分析了高速信号采集板和高速信号处理板散热分布,并依据散热分布建立了两种散热分析模型,通过理论计算得出符合设计要求设计方案;然后采用FloTHERM软件进行了热分析。FloTHERM软件分析结果表明:在55℃工作环境下,最热处为DSP芯片,温度为78℃左右,热量成辐射状散开,整体设备壳温为60℃左右,满足模块散热需求,验证了机箱热设计的合理性。According to the small high-speed signal processing module gradually to the characteristics of the miniaturization, mieromation, portable, a design scheme of stackable small high-speed signal processing module is introduced. The scheme on the basis of equipment all closed cavity structure, analyzes the high-speed signal acquisition boards and high-speed signal processing board heat distribution, and two kinds of thermal analysis model is established based on the heat dissipation distribution, through the theoretical calculation design plan comply with the design requirements; then analyzed the thermal by the FloTHERM software. FloTHERM software analysis results show that： in 55 ℃ work environment, the hottest place is DSP chip, about 78℃, the heat into radial scatter, overall equipment shell temperature about 60 ℃, meet the requirements of heat dissipation, verified the rationality of the design of heat.

关 键 词：热分析 堆叠式 高速信号处理 FLOTHERM 

分 类 号：TN06[电子电信—物理电子学]