多层互联阻抗过程控制研究  

The research of controlling the multilayer series impedance

作　　者：陈奎全 

机构地区：[1]无锡深南电路有限公司,江苏无锡214142

出　　处：《印制电路信息》2017年第A01期21-26,共6页Printed Circuit Information

摘　　要：随着电子技术的不断进步，来越多的电子产品设计体现出高速，高性能、高密度的特点，尤其在通讯、计算机、航空航天以及图象处理等领域。信号传输频率越来越快，阻抗对PCB信号完整性的影响不容忽视。越来越多的PCB高多层次信号传输都是从某层互连线传输到另一层，互连线就需要通过过孔来实现连接，在设计及加工过程中多层互联阻抗的控制更为困难。文章主要对多层叠加互联阻抗设计进行研究，归纳总结设计方法，提高产品的一次合格率。With the development of electronic technology, high-speed,high-capability, high-density are required it more electronic product, especially in the area of communication,computer, air ＆ spaceflight and graphics treatment. The signal transmission frequency is faster and faster, that the effect of impedance on PCB SI cannot be ignored. More and more signal line of high multilayer PCB are from one layer to another layer, which need connect by via holes, so it is more difficult to control the multilayer series impedance in the process of design and fabrication. This paper mainly studies the multilayer series impedance design, the design method is summarized to improve the first qualified rate of product.

关 键 词：阻抗 过孔 背钻 焊盘/反焊盘 

分 类 号：TN41[电子电信—微电子学与固体电子学]