微波印制板的技术发展及其应用研究  

Technical developments and application of microwave PCB

作　　者：袁欢欣 

机构地区：[1]汕头超声印制板公司,广东汕头515065

出　　处：《印制电路信息》2017年第A01期119-126,共8页Printed Circuit Information

摘　　要：随着民用雷达、现代通讯技术、精确／快速测向系统的快速发展，微波印制板的市场发展及其应用已引起很大关注。文章在概述目前汽车与无人机毫米波雷达应用、4C／5C微波通信技术及汽车V2X技术应用的基础上，进一步阐述了基于信号损耗控制考虑的微波基材选用和表面处理工艺、基于热管理考虑的微波散热产品设计以及基于微波粘结片或FR-4半固化片压合的微波多层化制造工艺等。此外，首次采用Smith圆图对比研究了不同微波材料在较高频率下的阻抗损失率，以期对微波选材做更深入的研究有所帮助。With the rapid development of civil radars, modem communication technology and accurate/ rapid direction-finding systems, the market development of microwave PCB and its application have attracted a substantial amount of attention. On the basis of technical development introduction of automotive and UAV （unmanned aerial vehicle） radar applications, 4G and 5G microwave communication technology and automotive V2X technology applications, the paper mainly discusses microwave substrate selection and surface treatment based on signal loss control, design of microwave cooling products based on thermal management and microwave multilayer PCB fabrication based on microwave bonding sheet or FR-4 prepreg. In addition, the impedance loss rate of different microwave materials at higher frequencies has been studied by Smith chart for the first time, which may be helpful to further research on microwave material selection.

关 键 词：印制板 微波 毫米波 热管理 史密斯圆图 

分 类 号：TN41[电子电信—微电子学与固体电子学]