Cu-Si合金的高温氧化行为  

High-temperature Oxidation Behavior of Cu-Si Alloys

作　　者：张顺科[1,2] 苏勇[1] 付广艳[1] 刘群[1] 

机构地区：[1]沈阳化工大学能源与动力工程学院,辽宁沈阳110142 [2]贵州工程应用技术学院毕节市煤磷化工工程技术中心,贵州毕节551700

出　　处：《沈阳化工大学学报》2017年第1期72-76,共5页Journal of Shenyang University of Chemical Technology

基　　金：贵州省高等学校创新能力提升计划(黔教合协同创新字[2014]08)

摘　　要：通过氧化动力学曲线的测定以及对氧化膜形貌和构成的分析,研究Cu-0.6Si和Cu-3.6Si合金在800℃、0.1MPa纯氧气条件下的高温氧化行为.结果表明:两合金氧化24 h后形成的氧化膜结构依次为CuO,Cu_2O,Cu_2O和SiO_2的混合氧化物,均未形成连续的SiO_2氧化膜.随着Si含量的提高,合金氧化膜内层SiO_2含量明显提高,这有利于通过限制合金元素和氧的扩散提高合金的氧化抗力.Cu-3.6Si合金较Cu-0.6Si合金氧化膜内孔洞减少,致密度增加,这得益于SiO_2对合金氧化膜内孔洞的补偿.SiO_2对Cu较大的PBR值是两种合金氧化膜容易开裂的重要原因.By means of the measurements of oxidation kinetic curves and the analysis on compositions and morphologies of oxide scales ,the high-temperature oxidation behavior of Cu-0.6Si and Cu-3.6Si al- loys at 800 ℃ in 0. 1 MPa flowing pure O2 has been investigated. Results show that the oxide scales of the two alloys consist of CuO, Cu2O and complex oxides of Cu2O and SiO2 from outside to inside after 24 h oxidation,and no continuous layers of SiO2 are formed. The SiO2 content in the inner layers of oxide scales increases with the Si content, which is beneficial to improving the oxidation resistance of the alloys by hindering the diffusion of alloying elements and oxygen. Benefited from the compensation of SiO2 for holes in oxide scales, the oxide scales formed on Cu-3.6Si alloy have less holes and larger density than Cu-0. 6Si alloy. The bigger PBR of SiO2 to Cu is the important reason for the fact that the oxide scales on the alloys are easy to crack.

关 键 词：Cu—Si合金 高温氧化 氧化膜 腐蚀 

分 类 号：TG172[金属学及工艺—金属表面处理]