聚噻吩插层有机蒙脱土导电复合材料的制备及其修饰  

PREPARATION AND MODIFICATION OF PTP-OMMT COMPOSITES

作　　者：焦钰[1,2] 邱克辉[2] 

机构地区：[1]西昌学院轻化工程学院,四川西昌615013 [2]成都理工大学材料科学技术研究所,四川成都610059

出　　处：《矿物岩石》2017年第1期7-14,共8页Mineralogy and Petrology

基　　金：四川省教育厅科研计划项目<稀土复合阻燃材料对森林火灾影响的研究>13ZB0171

摘　　要：实验采用Fe^(3+)-H_2O_2催化氧化体系,以水为介质,十二烷基苯磺酸钠(十二烷基苯磺酸钠)为乳化剂,室温下制备聚噻吩(PTP)有机蒙脱土(OMMT)复合材料。当有机蒙脱土/聚噻吩=2g/ml时,反应时间为12 h,制得复合材料电导率最高,其值为3.44×10^(-5)S/cm;在Fe^(3+)-H_2O_2和过硫酸铵(APS)两种氧化体系下,分别采用苯胺(ANI)和吡咯(PY)对聚噻吩-有机蒙脱土进行修饰,制得聚苯胺-(聚噻吩-有机蒙脱土)和聚吡咯-(聚噻吩-有机蒙脱土)复合材料的电导率均达到10^(-2)S/cm^10^(-1)S/cm,较未修饰时提高了10~3倍~10~4倍。傅里叶红外光谱(FTIR)和X射线衍射(XRD)表明噻吩(TP)进入有机蒙脱土层间聚合,形成插层复合,经苯胺和吡咯修饰后,插层结构没有被破坏;重分析(TG)则证实复合后材料热稳定性得到提高,500℃时失重在11.69%左右,但经修饰后材料的热稳定性有所降低500℃时失重达到80%以上。扫描电镜(SEM)表明在Fe^(3+)-H_2O_2氧化体系下,经修饰后材料形貌更规整,且均为球形。Polythiophene-organic montmorillonite （PTP-OMMT） composites were successfully prepared via Fe^3＋-H2O2 catalytic oxidation system at room temperature,in which water was used as the medium and sodium dodecyl benzene sulfonate as emulsifier. When the ratio of OMMT/ PTP was 2 g/ml, the maximum conductivity of the montmorillonite achieved 3.44 × 10^-5 S/cm. The PTP-OMMT composites were modified with aniline （AND and pyrrole （PY） under Fe^3＋- H2O2 and ammonium persulfate （APS） oxidation systems and the conductivity of PANI-（poly （organic-montmorillonite）） and polypyrrole-（poly （organic-montmorillonite）） composites was 10^-2 S/cm～10^-1 S/cm,three to four orders of magnitude higher than that of the unmodified. FTIR and XRD analyses showed that TP was intercalated into the interlayer of the montmorillonite to form intercalation compound, and the intercalated structure was not destroyed after modification with the aniline and pyrrole. Thermogravimetric analysis （TGA） showed that the thermal stability of the composites was improved,with the weight loss of approximately 11.69% at 500 ℃ ,while the stability was reduced by more than 80% of weight loss. SEM analysis revealed that the morphology of the modified composites was more regular and spherical in the Fe^3＋-H2O2 oxidation system.

关 键 词：聚噻吩 有机蒙脱土 复合材料 修饰 

分 类 号：TB383[一般工业技术—材料科学与工程]