一种新型LDI复合对位标靶在HDI生产中的应用  

A new LDI complex alignment target position in the HDI for production application

作　　者：罗登峰 李华平 李益斌 

机构地区：[1]梅州市志浩电子科技有限公司,广东梅州514000

出　　处：《印制电路信息》2017年第4期56-60,共5页Printed Circuit Information

摘　　要：HDI板中同时存在激光孔及机械通孔,且两种孔的对位基准点与设备精度不同,很难同时保证激光孔及机械通孔的对准度。本文主要介绍了一种新型的LDI复合对位标靶的设计,通过制程中对位方式的优化重组,以此提升激光孔与机械通孔的涨缩匹配性。For HDI board there are laser holes and mechanical through-hole at the same time, and the two kinds of holes of the reference point / equipment accuracy are different in the line alignment process. Therefore, in the line alignment process, it is difficult to ensure the laser hole and the mechanical through-hole alignment. It easily leads to laser holes or mechanical through-hole ring deviation. In this paper, a novel design of LDI compound alignment target is introduced to optimize the alignment of the laser hole and the mechanical through hole in the manufacturing process.

关 键 词：复合对位标靶 激光孔 机械通孔 位移差异性 对位 涨缩 

分 类 号：TN41[电子电信—微电子学与固体电子学]