Microstructure and mechanical property of Sn–Ag–Cu solder material  

作　　者：Yi-Gang Kong Zhi-Gang Kong Feng-Min Shi 

机构地区：[1]School of Mechanical Engineering,Taiyuan University of Science and Technology,Taiyuan 030024,China [2]Research Laboratory of Electrical Contacts,Beijing University of Posts and Telecommunications,Beijing 100876,China [3]Technology Department,Jinan No.10 Radio Factory Co.,Ltd.Jinan 250100,China

出　　处：《Rare Metals》2017年第3期193-197,共5页稀有金属（英文版）

基　　金：financially supported by the Chinese Universities Scientific Fund(No.2013RC0402);the Science&Technology Planning Project of Jinan City,China(No.201401056);the Natural Science Foundation of Shanxi Province,China(No.2013011023-5);the Taiyuan University of Science&Technology Doctoral Fund(No.20122029)

摘　　要：Among the lead-free solder materials,Sn-Ag-Cu alloys have many advantages,such as good wetting property,superior interfacial properties and high creep resistance.In this article,the organization and welding performance of Sn-Ag-Cu material were investigated.The surface morphology of the two alloys was observed by stereoscopic microscope and scanning electron microscope （SEM）.Chemical constitution was examined by X-ray energy-dispersive spectroscopy （EDS）.The mechanical properties of Sn-Ag-Cu solder were evaluated systematically compared with those of Sn-Cu solder.The results show that Sn-Ag-Cu solder based on different solder pads has different welding properties.The thickness of intermetallic compound （IMC） at the interface increases with aging time.For the gold-plated pads,there are a large number of IMC graphic,and in the welding interface,it can reduce the reliability of electrical connection.The Sn-Ag-Cu solder joints show a superior mechanical property over the traditional Sn-Cu solder.The number of dimples decreases and that of cavities increases for Sn-Cu0.7 alloy and the fracture surfaces of Sn-Ag3.0-Cu0.5 alloy have many small size dimples which are homogeneously distributed.Among the lead-free solder materials,Sn-Ag-Cu alloys have many advantages,such as good wetting property,superior interfacial properties and high creep resistance.In this article,the organization and welding performance of Sn-Ag-Cu material were investigated.The surface morphology of the two alloys was observed by stereoscopic microscope and scanning electron microscope （SEM）.Chemical constitution was examined by X-ray energy-dispersive spectroscopy （EDS）.The mechanical properties of Sn-Ag-Cu solder were evaluated systematically compared with those of Sn-Cu solder.The results show that Sn-Ag-Cu solder based on different solder pads has different welding properties.The thickness of intermetallic compound （IMC） at the interface increases with aging time.For the gold-plated pads,there are a large number of IMC graphic,and in the welding interface,it can reduce the reliability of electrical connection.The Sn-Ag-Cu solder joints show a superior mechanical property over the traditional Sn-Cu solder.The number of dimples decreases and that of cavities increases for Sn-Cu0.7 alloy and the fracture surfaces of Sn-Ag3.0-Cu0.5 alloy have many small size dimples which are homogeneously distributed.

关 键 词：Lead-free solder ORGANIZATION Weldingperformance Intermetallic compound 

分 类 号：TG42[金属学及工艺—焊接] TG146.21[一般工业技术—材料科学与工程]