生物质中温热熔预浸料用环氧树脂体系  

Bio-based Epoxy Resin System for Hot-melt Prepreg Curing at Mid-temperature

作　　者：张旭锋[1] 余金光 韦家虎[1] 益小苏[1,2] 

机构地区：[1]北京航空材料研究院,北京100095 [2]中航复材(北京)科技有限公司,北京101300

出　　处：《材料工程》2017年第4期96-101,共6页Journal of Materials Engineering

基　　金：基金项目:中欧合作H2020(MJ2015-HG-103)

摘　　要：采用生物质松香酸酐固化剂,通过配方设计和筛选,由配方体系成膜性、胶膜储存期、胶膜状态及DSC测试初步确定生物质环氧树脂体系的配方组成环氧树脂/固化剂/促进剂的质量比为100/60/3~4。由动态/稳态DSC测试和锥板旋转黏度计对体系的固化特征温度和黏度-温度-时间特性进行研究,结果确定树脂体系可在120~140℃完成固化,热熔法预浸温度范围60~85℃,其黏度在1500~5000mPa·s,其中70℃操作时间达180min。最后由红外光谱和DSC对生物质环氧体系的固化反应机理进行了研究。A novel bio-based epoxy resin system with rosin-sourced acid anhydrides was established by formula design and selection according to the resin film's forming performance and state with different storage time.The formula involves epoxy resin/curing agent/accelerator with mass proportion of 100/60/3-4.The curing property and the relationship between viscosity-temperature-time of resin were characterized by dynamic or steady state DSC analysis and cone plate viscometer,respectively.The results show the resin system can be cured at the range of 120-140℃,and the range of hot melt prepreg temperature is 60-85℃ with the viscosity from 1500mPa·s to 5000mPa·s.The processing time of hot melt prepreg is about 180 min at 70℃.The curing mechanism of bio-based resin was also investigated through the samples with different curing time by IF and DSC.

关 键 词：生物质 环氧树脂 中温固化 热熔预浸 

分 类 号：TB332[一般工业技术—材料科学与工程]