0.5mm节距数模混合陶瓷封装外壳加工工艺研究  

Research on Technology of 0.5mm Pitch Analog-digital Mixed Ceramic Package

作　　者：唐利锋[1] 庞学满[1] 陈寰贝[1] 李永彬[1] 夏庆水[1] 曹坤[1] 

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《固体电子学研究与进展》2016年第1期83-86,共4页Research & Progress of SSE

摘　　要：采用多层高温共烧陶瓷工艺制作了外形尺寸为21.0mm×8.8mm×2.0mm、引线节距为0.5mm的数模混合集成电路封装外壳,研究了加工工艺对外壳性能的影响。结果表明,采用稳定生瓷片尺寸、精密制版、提高钨金属化浆料流变性、优化印刷参数设置等能够使外壳微波传输线的连续性得到改善。The multilayer high temperature cofired ceramic process was employed in order to manufacture a kind of package with pitch of 0.5mm and dimensions of 21.0mm×8.8mm×2.0mm.The effects of manufacturing process on package properties were researched in this paper.It was found that less shrinkage of ceramics,fine silk screen,high rheological property of pastes,optimized printing parameter settings could improve continuities of microwave transmission line in the process of package fabrication.

关 键 词：数模混合陶瓷外壳 高温共烧陶瓷 

分 类 号：TN405[电子电信—微电子学与固体电子学]