压电耦合智能板结构中微损伤识别方法研究  

Research on Micro-damage Identification Method of Intelligent Piezoelectric Plate Ptructure

作　　者：李默[1] 

机构地区：[1]江苏大学理学院

出　　处：《电子科技》2017年第4期5-10,共6页Electronic Science and Technology

基　　金：国家自然科学基金(11172114)

摘　　要：基于小波包能量谱分析方法,研究了压电耦合板结构中微损伤及其损伤程度的检测和识别方法。通过建立压电耦合板的谱有限元模型,数值模拟研究了金属板中微小凹陷损伤发生细微变化时传感器的动态响应;进而采用小波包分析技术对响应信号进行分解,得到一系列子信号的能量谱,分析了不同程度凹陷损伤对各节点能量谱的分布和幅值变化所产生的影响。研究结果表明,小波包能量谱能够对微小凹陷损伤及其损伤程度进行较为灵敏地识别,为实际检测工作提供了参考。Based on the analysis technology of wavelet packet energy spectrum,the problem of micro damage and its degree detection in piezoelectric intelligent plate structure is studied in this paper. Numerical simulation is used to simulate the response signal of the structure containing micro groove damage with its degree changes. The response signal is decomposed by wavelet packet analysis to get a series of sub-signals and energy spectrums accordingly. The relationship between the distribution of energy spectrum and the degree of groove damage is researched. Research indicates that the wavelet packet energy spectrums can sensitively recognize the groove damage and its’ degree.The results can provide important guidance for real testing work.

关 键 词：小波包能量谱分析 超声导波 压电晶片 谱有限元 微损伤 

分 类 号：TN304.9[电子电信—物理电子学] O422[理学—声学]