微孔发泡聚合物基导电复合材料的研究进展  

Research Progress of Microcellular Foamed Polymer-Based Conductive Composites

作　　者：赵静静[1] 张晓黎[1] 王喜焕 李昆[1] 陈静波[1] 

机构地区：[1]郑州大学材料科学与工程学院,郑州450001

出　　处：《高分子通报》2017年第3期33-41,共9页Polymer Bulletin

基　　金：国家自然科学基金项目(11372284);河南省教育厅重点科研项目(15A430049;17A430005)

摘　　要：概述了用超临界流体作为物理发泡剂对聚合物基导电复合材料进行微孔发泡的基本原理,总结了聚合物基导电复合材料及其微发泡复合材料的几种导电机理,简要介绍了近年来微孔发泡聚合物基导电复合材料电学性能的研究现状。并从微发泡聚合物基导电复合材料的基体特性、所使用的导电填料类型、导电填料的含量、填料在基体中的分散方法及微发泡复合材料的泡孔形态等几个方面,分析了影响微孔发泡聚合物基导电复合材料电学性能的主要因素,并展望了新型微孔发泡聚合物基导电复合材料的研究和发展趋势。In this paper,the basic principle of microcellular foamed polymer-based conductive composites using supercritical fluid as a physical foaming agent is briefly introduced.Several conductive mechanisms of polymer-based composites and its microcellular foamed materials are reviewed.The research status of these composites on the electrical properties in recent years are illustrated summarily.The main factors,such as the characteristics of the matrix,the type of nano-sized conductive fillers,the filler loading content,the dispersion methods of the additives in the matrix,and the cell morphology,which affect the electrical properties of microeellular foamed polymer-based conductive composites are analyzed.Finally,the research trends of the novel microcellular foamed polymer-based conductive composites is prospected.

关 键 词：微发泡 导电复合材料 电学性能 

分 类 号：TQ317[化学工程—高聚物工业] TB33[一般工业技术—材料科学与工程]