碳纤维表面电镀铜层微观形貌表征及分析  

Characterization and analysis on microstructure of copper plating layer on carbon fiber surface

作　　者：季根顺[1,2] 张育铭[2] 薛向军 刘金欣[2] 

机构地区：[1]兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,甘肃兰州730050 [2]兰州理工大学材料科学与工程学院,甘肃兰州730050 [3]甘肃郝氏炭纤维有限公司,甘肃兰州730010

出　　处：《金属热处理》2017年第4期163-166,共4页Heat Treatment of Metals

摘　　要：采用电镀法制备了镀铜短碳纤维,借助扫描电镜(SEM)对镀层微观形貌以及镀层厚度进行了微观表征,并利用X射线光电子能谱(XPS)分析技术对镀层的化学成分和镀层中主要元素化合价态进行了分析。结果表明:经过预处理的碳纤维表面变得粗糙,有很多亲水性含氧官能团;电镀电压2 V,电镀时间20 min,电镀温度30℃时,可获厚度约1.2μm、短碳纤维端头被镀层紧紧包裹的均匀电镀层;镀层中间大部分铜以单质形式存在,表面镀铜层被氧化成氧化铜,镀层仿形生成,与碳纤维形成一个紧密的镶嵌体系。Copper coated short carbon fibers were prepared by electroplating method. The microstructure and thickness of the copper layers were observed by means of scanning electron microscopy（ SEM）. The chemical ingredients,chemical states of various elements were analyzed by means of X-ray photoelectron spectroscopy（ XPS）,and the electroplating process was studied. The results show that the surface of carbon fiber becomes rough,and there are a lot of hydrophilic oxygen-containing functional groups after pretreatment. When electroplating voltage is 2 V for 20 min at 30 ℃,the layers of copper with thickness about 1. 2 μm can be obtained,and the fiber end is wrapped tightly by uniform electric plating. The copper layers are mainly in the form of copper itself,and some of copper on the surface of layers is oxidized into Cu O. Therefore a profile is generated between carbon fibers and copper layer,forming a tight inlay system.

关 键 词：碳纤维 电镀 微观形貌 

分 类 号：TG174[金属学及工艺—金属表面处理]