酸性光亮镀铜溶液降低氯离子浓度的处理方法  

The Method of Lowering the Chloride Ion Concentration in the Acidic Bright Copper Plating Solution

作　　者：黄业[1] 谢静静[1] 唐春保[1] 

机构地区：[1]嘉应学院,广东梅州514015

出　　处：《广东化工》2017年第7期149-149,123,共2页Guangdong Chemical Industry

基　　金：广东大学生科技创新培育专项资金(pdjh2016b0469)

摘　　要：酸性光亮镀铜工艺发展已久,目前已经被广泛使用。氯离子作为酸性光亮镀铜中不可缺少的一种成分,对酸性光亮镀铜工艺起着重要的作用,因此,氯离子浓度应当控制在工艺范围内。若系统中的氯离子浓度过低时可以通过加入计算量的盐酸,调整到工艺范围;若氯离子浓度过高时,仅仅靠系统电解消耗来降低其含量,则需要较长的时间,这将严重影响生产质量。论文介绍了几种处理酸性光亮镀铜中氯离子浓度过高的方法。Acidic bright copper plating technique has been developed for a long time and now been widely used. As an indispensable component of acidic bright copper plating, chloride ion play an important role in the acidic bright copper plating process. Therefore, the concentration of chloride ion should be controlled within the process scope. If the concentration of chloride ion in the solntion is too low, it can be adjusted to the process range by adding quantifiable acid. If it is too high, we just need to lower it by itself＇s electrolyzation. However, it will take lots of time, which will seriously affect the quality of production. This paper introduces several methods of dealing with the high concentration of chloride ion in acid bright copper plating.

关 键 词：酸性镀铜 氯离子 沉淀 

分 类 号：TQ[化学工程]