高能球磨热挤压制备AgSnO_2电触头材料及性能研究  

Properties of AgSnO_2 Contact Material Prepared by High Energy Ball Milling and Hot Extrusion

作　　者：杨增超 

机构地区：[1]德阳东汽电站机械制造有限公司,四川德阳618000

出　　处：《电工材料》2017年第2期3-5,8,共4页Electrical Engineering Materials

摘　　要：利用高能球磨湿混法制备出SnO_2超细粉体,然后采用高能球磨技术及热挤压等方法制备出AgSnO_2触头材料。对粉体微观结构的观察结果表明高能球磨湿混法能快速制备出SnO_2超细粉体,在制备的AgSnO_2粉末中,其SnO_2相均匀弥散分布在Ag基体内,采用退火工艺消除了AgSnO_2复合粉末的孔隙并改善了粉末的成型性能。最终制备出的AgSnO_2触头材料平均密度达9.567 7 g/cm^3,硬度HV为106.1,电导率达71.7%IACS。SnO2 superfine powder is prepared by high energy ball wet mixing milling, and AgSnO2 contact alloy is prepared by high energy ball milling and hot extrusion. The microstructures of the SnO2 powder and AgSnO2 powder are investigated. The results show that the high energy ball wet mixing milling is a method for quickly preparing SnO2 superfine powder. In the AgSnO2 powder, SnO2 uniformly disperse in the Ag. The formability of AgSnO2 powder is improved and pores are decreased by annealing. The average density, hardness and conductivity of the AgSnO2 contact alloy is 9.567 7 g/cm3, 106.1 HV and 71.7%IACS, respectively.

关 键 词：高能球磨 AGSNO2触头材料 退火 显微组织 

分 类 号：TM201.41[一般工业技术—材料科学与工程]