Ni对Cu/Al界面冶金反应及组织演变的影响  

Effects of Ni on Reaction Mechanism and Microstructure Evolution of Cu/Al Joining Interface

作　　者：魏艳妮[1] 罗永光 曲洪涛 谭世友[1] 邹军涛[1] 梁淑华[1] 

机构地区：[1]西安理工大学材料科学与工程学院 [2]云南驰宏锌锗股份有限公司

出　　处：《特种铸造及有色合金》2017年第4期402-406,共5页Special Casting & Nonferrous Alloys

基　　金：云南驰宏锌锗股份有限公司资助项目(湿法炼锌阴极导电头界面失效原因及其调控机制);中国博士后科学基金面上资助项目(2016M592823)

摘　　要：设计了不同厚度的Ni中间层,采用阶梯式真空扩散连接工艺方法,对Cu/Al的异质复合界面组织形貌及冶金反应进行了研究。利用扫描电镜(SEM)及能谱(EDS),对异质复合界面的微观组织进行了分析,采用剪切试验及显微硬度测试对异质复合界面的结合强度及硬度分布进行了研究。结果表明,Ni中间层可阻止Cu和Al间生成脆性金属间化合物,其中Ni/Al界面生成了明显的两层Al3Ni和Al3Ni2化合物,而Cu/Ni界面出现了明显的元素成分渐变的固溶体相;当添加Ni箔厚度为20μm时,Ni箔刚好消耗完,连接界面无明显缺陷,且界面的剪切强度最高。A stepwise vacuum diffusion bonding method was used to fabricate Cu/Al joint with varied thickness of Ni intermediate layer.The interfacial microstructure and metallurgical reaction between Cu and Al were investigated.The morphology and phase composition of heterogeneous composite interface were analyzed by scanning electron microscopy（SEM）and energy disperse spectroscopy（EDS）.The shearing strength and the micro-hardness of the joint were measured by shearing experiment and hardness testing.The results reveal that,Ni intermediate layer can prevent effectively generation of brittle intermetallic compound phase in the Cu and Al.Compound phase of two layer Al3Ni and Al3Ni2 can be observed in Ni/Al interface,and there exists solid solution phase with clear elemental composition gradient in the Cu/Ni interface.When Ni foil thickness is 20μm,Ni foil just be completely consumed,so obvious defects are absent in interface,and the interface shear strength reaches maximum value.

关 键 词：Ni中间层 扩散连接 微观组织 界面反应 

分 类 号：TG453.9[金属学及工艺—焊接]