半固化片打折导致的基材空洞改善  

Improve the CCL's inanition for prepreg's crease

作　　者：刘锦琼 张华[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523808

出　　处：《印制电路信息》2017年第5期30-33,共4页Printed Circuit Information

摘　　要：覆铜板的空洞缺陷,由于其本质是树脂的缺失,因此会导致电器元件之间的线路短路、高压失效等严重质量问题。而在覆铜板生产中,导致基材空洞的原因多种多样,本文重点分析了半固化片打折导致的基材空洞问题,并初步摸索了形成机理及部分生产中的实际解决方法。circuit and high s inanition. Here Because lack of resin, the CCL＇s inanition will lead to serious quality problems, such as short voltage failure for electrical components. Actually, there are many ways which will lead to CCL＇s the detailed analysis of how Prepreg＇s crease leads to inanition. Also a preliminary research is made about it＇s cause and solution

关 键 词：覆铜箔板 半固化片打折 基材空洞 

分 类 号：TN41[电子电信—微电子学与固体电子学]