聚苯并噁嗪高性能化:分子设计、合金与纳米复合物  

High performance polybenzoxazine:molecular design,alloys and nanocomposites

作　　者：朱维维[1] 高秀秀[1] 展艳珊 王云晶[1] 刘晓惠[1] 张文凯[1] 丁涛[1] 房晓敏[1] 

机构地区：[1]河南大学化学化工学院,河南开封475004

出　　处：《化学研究》2017年第2期157-168,共12页Chemical Research

基　　金：国家自然科学基金(51403051);河南省高等学校重点科研项目计划(16A150003)

摘　　要：聚苯并噁嗪通过环状苯并噁嗪单体热诱导开环聚合得到,作为一种新型的酚醛树脂,不仅具有传统酚醛树脂的耐热、低吸水性等性质,还具有传统酚醛树脂不具备的性能,如分子设计的灵活性、固化反应没有小分子副产物产生、优异的尺寸稳定性以及良好的阻燃性能,在微电子、印刷电路板、电子封装以及航空航天等高技术领域具有广阔的应用前景.然而,聚苯并噁嗪缺点是固化温度高、固化材料脆性大.本文介绍了聚苯并噁嗪性能增强的各种方法,包括新型单体分子设计、引入可交联单元、高相对分子质量聚合物前体制备、聚合物合金化、纳米复合等.最近,石墨烯和笼型聚倍半硅氧烷(POSS)与聚苯并噁嗪复合材料因具有优异的热性能和电学性能,成为先进电子材料的潜力材料.As a new type of phenolic resin, polybenzoxazine has not only the advantages of traditional phenolic resins such as high thermal properties and low water absorption, but also other properties not found in conventional phenolic resins such as molecular design flexibility, no by-products release du- ring the curing process, high dimensional stability and excellent flame-retardancy. In recent years, the processing of benzoxazine resins have received increasing attention from microelectronic, printed circuit board or encapsulation, and aerospace industries. Typical drawbacks of polybenzoxazines are the high temperatures required for curing and the brittleness of the cured material. In this review, various me- thods for enhancing the performance of polybenzoxazines are described, including the molecular design of monomers, introduce cross-linkable units, high relative molecular weight polymer precursors, poly- mer alloys and nanocomposite. Recently, polybenzoxazine nanocomposites constructed with graphene composite and POSS rise have become the potential candidates for electronic applications due to their excellent thermal and dielectric properties.

关 键 词：苯并噁嗪 热固性 热性能 开环聚合 电学性能 

分 类 号：O633[理学—高分子化学]