添加元素Sn,Cu对Zn-Al钎料组织性能的影响  被引量:5

Effect of element Sn and Cu on microstructure and mechanical properties of Zn-10Al solder

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作  者:张冬冬[1] 刘树英[1,2] 陈泽[1] 张毅文[1] 

机构地区:[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]有色金属共性技术河南省协同创新中心,河南洛阳471023

出  处:《焊接》2017年第4期21-24,共4页Welding & Joining

基  金:河南科技大学大学生研究训练计划(SRTP)项目;河南省杰出青年基金资助项目(144100510002)

摘  要:向Zn-10Al基体中添加元素Cu,采用真空炉VF-1600M、金相显微镜、岛津AG-125KN精密万能材料试验机等,研究了Cu元素对Zn-Al钎料合金的熔化特性、润湿性能、金相组织以及力学性能的影响。结果表明,随着Cu元素的增加,钎料的熔点呈先下降后上升的趋势,在铜添加量为4%(质量分数)时,熔点最低;在铜添加量为5%时,润湿性能优良,钎料晶粒最细小,抗拉强度最好;当铜添加量继续增大时,其润湿性能下降,钎料晶粒变大,抗拉强度降低。其次研究了Sn元素的添加量对Zn-10Al-5Cu钎料性能的影响。结果表明,当Sn添加量达到3%时,其抗拉强度良好,钎料的熔化温度降低,在Cu上的润湿性能良好。当锡添加量进一步增加时,钎料合金的的润湿性能降低,基本不铺展。试验得到的Zn-10Al-5Cu-3Sn为性能较为优良的铝/铜钎焊用钎料。The Cu element was added to the Zn-10Al matrix,the microstructure of Cu elements of Zn-10Al matrix alloy melting characteristics,wetting properties,and the mechanical properties were studied by using vacuum furnace VF-1600 M,metallographic microscope,SHIMADZU AG-125 KN precision universal material testing machine. The results show that with the increase of the Cu content,the melting point of the solder decreases first and then increases. When the copper content is 4%( mass fraction),the melting point of the solder is the lowest.When the copper content is 5%,the wetting property is good,the grain of the solder is fine,and the tensile strength is the highest. When the copper content is continued to increase,the wettability of the solder is improved,the grain size becomes coarser,and the tensile strength decreases. Secondly,the effect of the addition amount of Sn elements on the properties of Zn-10Al-5Cu solder was also studied. The results show that the tensile strength is excellent,the melting temperature of the solder is decreased,and the wetting property of the solder is good when the amount of Sn addition is 3%. When the Sn content increases further,the wettability of solder alloy becomes poor,which does little spread.The obtained Zn-10Al-5Cu-3Sn is an excellent aluminum/copper brazing filler metal.

关 键 词:钎焊 ZN-AL钎料 抗拉强度 润湿性 金相组织 

分 类 号:TG456.7[金属学及工艺—焊接]

 

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