薄的深色表面层金相试样的制备方法  

Method for Preparing Metallographic Samples with Thin and Dark Surface Layer

作　　者：郭海霞[1] 王明建[1] 王世宁[1] GUO Hai-xia WANG Ming-jian WANG Shi-ning(Luoyang Ship Material Research Institute, Luoyang 471023, China)

机构地区：[1]洛阳船舶材料研究所,洛阳471023

出　　处：《理化检验（物理分册）》2017年第4期253-254,共2页Physical Testing and Chemical Analysis(Part A:Physical Testing)

摘　　要：针对薄的深色表面层金相试样常规方法难以制备的情况,介绍了两种适用于该类表面层保护的金相试样制备方法,其中方法一是将两个相同试样的表面层相对贴合,方法二是将一薄铜片与表面层紧密贴合;然后将该两种方法的制样效果与常规制样方法的进行对比。结果表明:该两种方法均可以有效保护金相试样表面层,而且便于表面层显微形貌的观察和厚度测量。For the situation that the metallographic samples with thin and dark surface layer were difficult to be prepared by the conventional method, two kinds of metallographic sample preparation methods for the protection of such surface layer were introduced. One of the methods was to make the surface layers of the two identical samples closely contact to each other, and the other method was to make the surface layer tightly attach with a thin copper sheet. The preparation effect of these two methods was compared with that of the conventional method. The results show that both of these two methods could effectively protect the surface layer of metallographic samples, and make observing or measuring the surface layer easier.

关 键 词：薄的深色表面层 金相试样 制备方法 

分 类 号：TG115.2[金属学及工艺—物理冶金]