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作 者:李广锋[1] 侯永改[1] 高元[1] 李文凤[1] 黄庆飞[1] 丁志静[1]
机构地区:[1]河南工业大学材料科学与工程学院,郑州450001
出 处:《金刚石与磨料磨具工程》2017年第2期46-49,共4页Diamond & Abrasives Engineering
基 金:河南省科技厅重点科技攻关(112102210240);河南工业大学研究生教育创新计划(2012YJC76)
摘 要:采用粉末冶金法制备低温陶瓷/Cu-Fe-Sn基结合剂金刚石磨具。结合材料电子万能试验机、SEM、XRD等检测手段,研究了保温时间对低温陶瓷/Cu-Fe-Sn基结合剂磨具性能与结构的影响。结果表明:当热压烧结保温时间为8min时,低温陶瓷/Cu-Fe-Sn基结合剂磨具有最佳的力学性能(抗弯强度285.6 MPa,冲击强度10.88kJ/m2);保温时间延长促进了低温陶瓷在金刚石表面铺展润湿,保温8min时,低温陶瓷/Cu-Fe-Sn基结合剂可达到最佳的机械嵌合,提高结合强度。Low-temperature vitrified/Cu-Fe-Sn-based bond diamond tool was prepared by the method of powder metallurgy. Bending strength and impact strength of sam tester and their micro-topography were analyzed by using XRD an pl d es were tested by using mechanical SEM. Results show that when the heat preservation is 8 rain, the mechanical property of vitrified/Cu-Fe-Sn-based bond diamond tool reaches its maximum value, namely bending strength 285.6 MPa and impact strength 10.88 kJ/m2 Prolonged holding time could promote low-temperature ceramic spreading on diamond surface. When the holding time is 8 min, the low temperature ceramic /Cu-Fe-Sn based binder can achieve the best mechanical fit and improve the bonding strength.
分 类 号:TG74[金属学及工艺—刀具与模具]
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