丁二酸钠对化学镀Ni-P合金镀层的影响  

Influences of Sodium Succinate on Electroless Plated Ni-P Alloy Coating

作　　者：张东梅 赵丹 徐旭仲 王朝 仉建波 吴子娇 刘婧 

机构地区：[1]华北理工大学冶金与能源学院,河北唐山063009

出　　处：《电镀与精饰》2017年第5期43-46,共4页Plating & Finishing

基　　金：河北省科技厅科技计划项目(15211037);华北理工大学大学生创新项目(X2016142)

摘　　要：采用化学镀方法在Q235钢表面施镀Ni-P合金镀层,研究丁二酸钠对Ni-P合金镀层沉积速率、组织和P含量的影响,探究镀液中丁二酸钠的最佳浓度。结果发现,当Ni-P合金镀液中丁二酸钠质量浓度达到18 g/L时,镀层连续致密,表面平整,胞状组织尺寸较小,镀层的质量最好;随着丁二酸钠用量的增加,沉积速率呈现先增大后减小的趋势,当丁二酸钠质量浓度达到18 g/L时,沉积速率达到最大值12.785μm/h;镀层中P的质量分数为10.87%。Ni-P alloy coating was plated by electroless plating method on Q235 steel surface. Influences of sodium succinate on deposition rate, microstructure and P content of the Ni-P alloy coating were studied,and the optimal sodium succinate concentration in the electroless plating solution was explored. Results showed that when the sodium succinate concentration reached to 18 g/L,the coating quality was the best with continuous and dense deposition layer, fiat surface and smaller cellular organization size;with increase of the sodium succinate dosage, the plating rate increased first and then decreased;when the sodi- um succinate concentration reached to 18 g/L,the plating rate reached to the maximum value of 12. 785 μm/h and P mass fraction in the coating was 10.87%.

关 键 词：NI-P合金镀层 化学镀 丁二酸钠 

分 类 号：TQ153.12[化学工程—电化学工业]