Bi对SnZnMg软钎料性能影响  

Effect of Bi on SnZnMg Solder Performance

作　　者：和欢 

机构地区：[1]郑州市国防科技学校,河南郑州450041

出　　处：《时代农机》2017年第4期77-78,共2页Times Agricultural Machinery

摘　　要：文章研究了Bi元素对SnZnMg钎料物理性能、工艺性能的影响,试验结果表明,随着Bi的增加,合金熔程增大,铺展性能和润湿性显著提高,这主要与形成的Sn-Bi二次相及钎料与基板件金属间化合物状态有关。The influence of Bi element on the physical properties and process performance of SnZnMg solder is studied.The results show that with the increase of Bi,the melting rate of the alloy increases,the spreading performance and the wettability are improved obviously,which is mainly related to the formation of Sn -Bi secondary phase and the brazing filler metal and the inter-metallic compound state of the substrate.

关 键 词：SnZn共晶钎料 物理性能 工艺性能 熔程 

分 类 号：TG405[金属学及工艺—焊接]