Void defect detection in BGA solder joints using mathematical morphology  

BGA焊点空洞缺陷的数字形态学检测（英文）

作　　者：张俊生[1,2] 王明泉[2] 王玉[2] 王军[3] 郭晋秦[1] 

机构地区：[1]太原工业学院电子工程系,山西太原030008 [2]中北大学信息与通信工程学院,山西太原030051 [3]中北大学材料科学与工程学院,山西太原030051

出　　处：《Journal of Measurement Science and Instrumentation》2017年第2期199-204,共6页测试科学与仪器（英文版）

基　　金：National Science and Technology Major Project of the Ministry of Science And Technology of China(No.2013YQ240803);Shanxi Programs for Science and Technology Development(Nos.20140321010-02,201603D121040-1);Scientific and Technological Innovation Programs of Higher Education Institutions of Shanxi Province(No.2013063)

摘　　要：Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-ray images for detection However, it has always been difficult to analyze this problem automatically because of some challenges such as noise, inconsistent lighting and void-like artifacts. This study realized accurate extraction and automatic a-nalysis of void defects in solder joints by adopting a technical proposal, in which Otsu algorithm was used to segment solder balls and void defects were extracted through opening and closing operations and top-hat transformation in mathematical mor-phology. Experimental results show that the technical proposal mentioned here has good robustness and can be applied in the detection of voids in BGA solder joints.

关 键 词：ball grid array （BGA） void defect X-RAY OTSU mathematical morphology 

分 类 号：TN405[电子电信—微电子学与固体电子学] TP391.41[自动化与计算机技术—计算机应用技术]